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Current status and future development trend of semiconductor solder

At present, the common forms of electronic tin solder are: wire, strip, rod, bead, sheet, powder, paste, agent, etc. With the rapid development of the domestic electronics industry, electronic tin solder has been greatly developed. Ordinary wires, bars, rods, sheets, powders and agents are not inferior to foreign products, but in more refined products and certain Some high-end application areas still have considerable gaps with foreign products, and some even rely entirely on imports. At present, the annual output of the global electronic tin solder industry is about 200,000 tons, and the output value is about 26 billion yuan. The domestic annual output of electronic tin solder is about 130,000 tons, accounting for about 65% of the global output, and the output value is about 14 billion yuan. .


In recent years, electronic tin solder has shifted to environmental protection and emerging industries, and the proportion of lead-free solder has increased year by year, accounting for about 60%. The tin solder industry structure has undergone significant changes. For example, the output of tin wire and tin bars has been steadily decreasing, and the market demand for tin powder and solder paste has increased year by year.


■ Status of tin powder

The current global demand for solder powder is about 20,000 tons, about half of which is concentrated in mainland China. There are now more than 20 tin powder manufacturers in mainland China, with a production capacity of about 16,000 tons, accounting for about 80% of global production capacity.


Consumer electronics products are the most frequently used solder powder. At present, the solder paste used in the mobile phone and notebook-based industries mainly requires T3 and T4 particle size solder powder. On these two models, in addition, with the refinement of electronic components and the continuous narrowing of the technology development, the amount of T5, T6, T7 solder powder is gradually increasing. The application of ultrafine powder (T6 / T7 / T8) in the future may be a necessary way in the development direction of tin powder.


Tin powder preparation technology is currently mainly ultrasonic atomization technology and centrifugal atomization technology, and gas atomization technology has been basically eliminated due to the low quality of the prepared tin powder. The specific preparation process mainly includes alloy smelting, atomizing powder milling, sieving powder sorting and packaging.


Foreign solder powder technology is mainly divided into centrifugal atomization technology based on Japanese and American companies such as Senju and Alpha, and ultrasonic atomization technology based on European companies such as PSP and IPS. Domestic companies headed by Beijing CommScope Swell, Yunnan Tin, Shandong Heraeus, Suzhou IPS, Taiwan Shengmao, etc., have basically realized high-tech centrifugal mist that integrates atomization powdering, pneumatic precision sorting, and screening technology Chemical technology and ultrasonic atomization technology have realized the continuous production of high efficiency, energy saving and environmental protection of SMT solder powder, and the products are quite close to the level of similar technical products abroad.



■ Status of solder paste

At present, the global annual demand for solder paste is about 25,000 tons. Since China is the world's largest electronics manufacturing base, some foreign manufacturers have also opened solder paste production plants in China, so the amount of solder paste in the world is seven or eight. Chengcheng is produced, processed and used in China.


Solder paste is one of the indispensable materials in the assembly of electronic products using the SMT process. Because electronic products are beginning to be integrated and complicated, the SMT process is initially replacing the traditional THT process, so the application of solder paste is in the foreseeable future. Will continue to increase.


Solder paste is not only used in the SMT assembly process of general consumer electronics, but also in the LED chip flip chip bonding process, photovoltaic soldering tape process, radiator pin barrel process, and many other occasions, almost all electronic products produce.



■ Status of BGA ball

BGA solder balls (BGA solder balls) are a type of connector used to replace the pins in the IC component packaging structure to meet the requirements of electrical interconnection and mechanical connection. Its terminal products are notebook, mobile communication equipment, LED, LCD, DVD, in-vehicle LCD TV, home theater, satellite system and other consumer electronic products, especially playing a vital role in the miniaturization process of large-scale integrated circuits.


According to the 'China Semiconductor Industry Association Packaging and Testing Branch' at the 8th National Annual Conference on Packaging and Testing, it published its research and analysis report on the semiconductor and solder ball industries. / Month, the annual demand is 5.1 million kk, reaching 950,000 kk / month in 2015, and the annual demand is 11.4 million kk. Among them: the annual domestic demand reached 1.2 million KK in 2010, and the domestic demand reached 3 million KK by 2016. It is expected to reach a consumption of 5 million KK by 2020.


Although the domestic BGA manufacturing technology has greatly improved, it still has a big gap compared with developed countries. Especially the high-precision, small-diameter solder ball spray molding process technology is the main research direction in the future.


 

■ Status of flux

Foreign flux manufacturers have been established for a long time, with mature technology, advanced equipment, strong R & D technical strength, high material requirements, high cost, and high market price, and occupy a leading position in international high-end brand enterprises.


The domestic flux industry started later than foreign manufacturers, but due to the huge market demand. Some domestic enterprises led by Shenzhen Tongfang, Victaulic, etc. in the tin solder branch seized the opportunity, strengthened scientific and technological research and development capabilities, strengthened product quality control, reduced product costs, followed the pace of foreign manufacturers, and launched a series of domestic flux brands And products, the technical indicators of some products have reached or even surpassed foreign products.


 

■ Direction of development

The key projects for the development of electronic tin solder during the 'Thirteenth Five-Year Plan' period include: energy-saving and environmentally friendly, highly reliable materials; electrical interconnect materials for ultra-high density; lead-free and antimony-free high-melting solder materials for chip packaging; .


At present, the development of welding material products has formed the development of lead-free, halogen-free, environmental protection and functionalization in the composition; in the direction of product quality to reliable quality and low cost; in the direction of product size to finer particle size and distribution span It has developed in narrower directions, and the technical indicators for evaluation have been gradually refined and improved. In addition, with the demand for the development of electronic products and their technologies, products have gradually developed into functionalization, low-temperature energy-saving and other directions. This development trend will be more demanding and strict on the quality of welding materials and manufacturing technology.



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